Dual-Channel Loading and Unloading Laser Solder Ball Jet Welding System
Advanced laser solder ball jet welding system designed for high-efficiency production line integration with dual working platforms for maximum equipment utilization.
Key Features
- Dual working platforms significantly improve equipment utilization efficiency
- High-precision solder ball jet welding with application range of 350μm-760μm (standard: 500μm-760μm)
- Non-contact laser welding eliminates electrostatic damage concerns
- Natural cooling solder ball solidification prevents surface burrs on solder joints
- Compact BOND HEAD welding mechanism for easy automated integration
- Flux-free operation ensures no pollution and maximizes electronic device lifespan
- Flexible welding capabilities by selecting appropriate solder ball sizes
- Advanced image recognition and positioning system for micro-precision device welding
- High efficiency and rapid processing speeds
The equipment operates via dual-channel loading and unloading system for continuous production workflow.
Technical Specifications
| Machine Model |
YSL-LS200 |
| Laser Wavelength |
1064nm |
| Laser Power |
200W |
| X&Y Axis Speed |
500mm/s maximum |
| Z Axis Speed |
300mm/s maximum |
| Axis Type |
Servo Motor |
| Repeat Positioning Accuracy |
±5μm |
| Visual Recognition Rate |
99.5% |
| Solder Ball Size Range |
350μm-760μm (standard 500μm-760μm) |
| UPH (Units Per Hour) |
>7,000-9,000 (PIN) |
| Operating Temperature |
25℃ |
| Operating Humidity |
30%-65% (No condensation) |
| Dimensions |
Approximately 1300×1340×1530 (mm) |
| Weight |
350kg (approximate) |
| Voltage |
220VAC, Single-Phase |
| Maximum Current/Frequency |
15A, 50/60Hz |
| Nitrogen Pressure |
0.5MPa |