1.60mm High Frequency Rigid Circuit Boards With GREEN Solder Mask
Production description :
this board is 6layer rigid pcb for wireless antenna . all of our board are met UL, ISO9001, TS1694 certification etc.no MOQ request for new boards, for repeat order, just meet 3sq.m.
Key Specifications of single PCB board :
Production Types: | Rigid PCB |
Layer : | 6 Layer |
Base Material : | FR4 fiber glass |
Copper Thickness : | 1 oz |
Board Thickness : | 1.60mm |
Min. Finish Hole Size : | 8 mil (0.10mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | OSP |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Quality Goal:
Category | Performance indicator | Quality Goal |
Delivery | Customer service rate | 99.9% |
Semi Finished product | Process inspection pass rate | 100% |
Finished product | FQA Rebate rate | 0.1% |
Scrapped | 1L scrap rate | 0.5% |
2L scrap rate | 1% | |
Multi Layer scrap rate | 2% | |
Customers | Customer complaint rate | 0.8% |
Customer return rate | 0.5% | |
Customer satisfaction | 99% |
Product Application Field :
FAQ
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.