OEM 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

PCB Flow Chart.pdf

Production description :

this board is 12layer PCB it is used on wireless charger. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

Key Specifications/Special Features :

Rigid PCB Technical Capability:

Quality assurance :

Every production process has a special person to test to ensure quality, AOI and E-testing.

Have professional engineers to check the quality

All products have passed CE, FCC, ROHS and other certifications

Application:

Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device

Shipping Information:
FOB Port : Hong Kong / Shenzhen Lead Time : 8 - 15 days
HTS Code : 8534.00.10 Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;