OEM ODM High TG PCB 0.8mm thickness 0.2mm holes size and lead free HAL 2oz copper thickness
Key Specifications/Special Features :
| Layer : | 4Layers | 
| Base Material : | Nanya FR4TG150 | 
| Holes : | Buried and Blinded holes | 
| Board Thickness : | 1.80mm | 
| Min. Hole Size : | 6mil, 0.15mm | 
| Min. Line Width : | 4/4 mil | 
| Min. Line Spacing : | 4/4mil | 
| Surface Finishing : | Lead Free HAL | 
| Solder Mask Color : | Green ,Red,Blue,White,Yellow,Red | 
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS | 
| Silkscreen color : | White,Yellow,Red,Black | 
| Outline : | Routing,V-Groove, Beveling punch | 
Application:
Industril Control System
 Power Supply
 LED drive, LED Lighting
 Communication Device
 automotive electronics
 Security Electronics
 Household Control
 Digital Appliances
 Frequency converter
 Medical Device
Technology Capability:
| Item | Technical Parameters | 
| Layers | 1-28 Layers | 
| Inner Layer Min Trace/Space | 4/4 mil | 
| Out Layer Min Trace,Space | 4/4 mil | 
| Inner Layer Max Copper | 4 OZ | 
| Out Layer Max Copper | 4 OZ | 
| Inner Layer Min Copper | 1/3 oz | 
| Out Layer Min Copper | 1/3 oz | 
| Min hole size | 0.15 mm | 
| Max.board thickness | 6 mm | 
| Min.board thickness | 0.2mm | 
| Max.board size | 680*1200 mm | 
| PTH Tolerance | +/-0.075mm | 
| NPTH Tolerance | +/-0.05mm | 
| Countersink Tolerance | +/-0.15mm | 
| Board Thickness Tolerance | +/-10% | 
| Min BGA | 7mil | 
| Min SMT | 7*10 mil | 
| Solder mask bridge | 4 mil | 
| Solder mask color | White,black,blue,green,yellow,red,etc | 
| Legend color | White,black,yellow,gray,etc | 
| Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG | 
| Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB | 
| Impedance control | +/-10% | 
| Bow and twist | ≤0.5 | 
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
 2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
 3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
 4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
  
            