OEM Rigid Circuit Heavy Copper PCB With Black Color for Elevator Control Panels

PCB Flow Chart.pdf

Key Specifications/Special Features:

Layer : 2 Layers

Base Material : KB FR4TG140
Copper Thickness : 2oz in all layer
Board Thickness : 1.62 mm
Min. Hole Size : 8 mil / 0. 2mm
Min. Line Width : 6 / 6 mil
Min. Line Spacing : 6 / 6 mil
Surface Finishing : Gold Flash ( au :2micron)

Fire-proof level : 94v0

Solder mask : Red

Certificate : UL, CQC, TS16949, ISO14000, ROHS

Quality Goal:

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Product Application Field :

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

5, Vehicle Electronices: Car etc;

6, Military & Defense : Military Weapons etc;

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;