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2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed
2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed
2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed
2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed
Specifications
Brand Name :
ACCPCB
Model Number :
P1105
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Payment Terms :
L/C / T/T / Western Union / Paypal
Supply Ability :
20000SQ.M/Per Month
Delivery Time :
10-12days
Packaging Details :
Vacuum packing with desiccant
Material :
Copper PCB Boards
Layer :
2 Layer
Thickness :
1.0mm
Copper Thickness :
1OZ
Surface Finish :
ENIG
Special Process :
Thermoelectric Separation
Description

2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed


Key Specifications:

Material :

copper pcb
Layer :

1 layer
Board Thickness :

1.60mm
surface copper thick :

2OZ
Min.Line Width :

10mil
Min.Space : 10mil
Solder process :

ENIG
Special process :

thermoelectric separation

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

 600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

 Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

 Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

 Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
 Max.board thickness(single&doule sided) 3.20mm


Quality assurance:
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certification

Shipping Information:

FOB Port : Hongkong / Shenzhen Lead Time : 7-15 days
HTS Code : 8534.00.10 Dimensions per Carton: 37X27X22mm
Weight Per Carton : 20 Kilograms

Main Export Markets:

  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

7. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed

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Product Detail
Brand Name :
ACCPCB
Model Number :
P1105
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Contact Supplier
video
2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed
2 Layer 1OZ Copper Clad PCB Board , Copper PCB Sheet ENIG Thermoelectric Separation Processed

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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