1.0mm thickness Al-based Copper PCB High Power Electrical Engineering Single Sided

Production description :

this board is 2layer PCB. it is used on power device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

Key Specifications:

Technology Capability:

Quality assurance:
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Shipping Information:

FOB Port : Hongkong / Shenzhen Lead Time : 7-15 days
HTS Code : 8534.00.10 Dimensions per Carton: 37X27X22mm
Weight Per Carton : 20 Kilograms

Main Export Markets:

• Asia
• Australasia
• Central/South America
• Eastern Europe
• Mid East/Africa
• North America
• Western Europe

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.