OEM Blue Peelable Glue Impedance Control PCB Green Solder Mask for 5G Equipment
Key Specifications/Special Features :
| Base Material : | ITEQFR4 |
| Board Thickness : | 2.4mm |
| Layers : | 10 layers |
| Copper thickness : | 1 / 1 / 1 / 1 / 1 / 1 / 1 / 1 OZ |
| Surface Finish : | HAL +Blue Peelable glue |
| Tolerance : | +/-0.01mm |
| Impedance : | 100Ohm |
| Min. Hole Size : | 0.150mm |
| Min. Line Width : | 0.1mm/4mil |
| Min. Line Spacing : | 4/4mil(0.1/0.1mm) |
| Company type: | Manufacturer/ Factory |
| Certificate: | UL, CQC, TS16949, ISO14000, ROHS |
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
Lead Time :
| Lead Time | 2 /L | 4 /L | 6/ L | 8/ L |
| Sample Order | 3-5days | 6-8days | 10-12days | 12-14days |
| Mass Production | 7-9days | 8-10days | 12-15days | 15-18days |
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
