FR4T G170 HDI PCB Board , PCB Printed Circuit Board Assembly Fabrication Interconnecnt

Key Specifications/Special Features:
Layer : 4 Layers
Base Material : FR4 tg170
Copper Thickness : 2 / 1.5 / 1.5 / 2oz,
Board Thickness : 1.2mm
Min. Hole Size : 5 mil, 0.127mm

Solder mask : Red
BGA pad size : 0.25mm
Line width/space : 5.0 / 5.0mil

Specialty : L1-2: laser blind via of 0.1mm and filled by plating
Application : Security syserms

Lead Time:

Main Export Markets:

• Asia
• Australasia
• North America
• Western Europe

Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.