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Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Specifications
Brand Name :
ACCPCB
Model Number :
P1134
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Payment Terms :
L/C / T/T / Western Union / Paypal
Supply Ability :
25000SQ.M/PER MONTH
Delivery Time :
15-20days
Packaging Details :
Vacuum packing with desiccant
Key Words :
High Density Interconnector
Material :
FR4 TG180
Layer :
10-layer PCB with 2+N+2 HDI structure
Apply For :
Main Board
Feature :
immersion gold(au:2u'')
Advantage :
High Quality and fast lead time
Description

Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface

Key Specifications/Special Features:
Layer : 10Layers
Base Material : FR4 halogen free
Copper Thickness : 1/1/1/1/1/1/1/1/1/1oz,
Board Thickness : 1.2mm
Min. Hole Size : 6 mil, 0.15mm

Impedance control : 50 ohm
BGA pad size : 0.28mm
Line width/space : 4.0/5.0mil
Buried holes from : L3 to L10
Laser via holes from : L1 to L2, L2 to L3,
Application : Smart home application

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

 600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

 Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

 Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

 Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
 Max.board thickness(single&doule sided) 3.20mm


Lead Time:

Types

(Max ㎡/month)

Samples

(days)

 Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

Main Export Markets:

  • Asia
  • Australasia
  • North America
  • Western Europe


Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

Product Show :

Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface

Product tags

0.6 mm thickness multilayer pcbs

,

1.6mm thick multilayer pcbs

,

how to make smd pcb
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Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface

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Product Detail
Brand Name :
ACCPCB
Model Number :
P1134
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Contact Supplier
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Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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