3 Layer 0.5oz HAL Lead Free PCB 1.2mm Thickness KB FR4 Material
Production description :
this board is 3layer with 1 oz copper thickness. we can accept PCB prototype,samll volum, middle and large volume. no MOQ request for new boards.
Production Types: | Rigid PCB |
Layer : | 3layer |
Base Material : | FR4 tg150 |
Copper Thickness : | 2oz |
Board Thickness : | 1.20mm |
Min. Finish Hole Size : | 8 mil (0.10mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | ENIG,OSP,HASL,Immersion Gold,Gold Plating |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.
Technical Capability:
ITEMS | Capability |
Max. layer count | 28L |
Min. line widty | 0.08mm |
Min. line spacing | 0.08mm |
Min. hole size | 0.15mm |
Board thickness | 0.4-6.0mm |
Max. boardsize | 520×620mm |
(PTH) Hole size tolerance(PTH) | ±0.075mm |
(NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
Holeposition tolerance(Routing) | ±0.1mm |
Outline tolerance(Punching) | ±0.1mm |
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.