Six layer FR4 Tg180 TS 16949 HDI PCB Board 1oz Copper Thickness
  
  
 Production description :
  
 this board is 6 layer. it is used for Car. we can accept any quantity. all of our PCB are met UL, TS 16949,ROHS, ISO Etc. certification. no MOQ request for new order. 
  
  
 Production Feature:
| Layer : | 6Layers | 
| Base Material : | FR4 Tg180 | 
| Copper Thickness : | 1oz in all layer | 
| Board Thickness : | 1.62 mm | 
| Surface Finish : | Immersion gold | 
| Min. Hole Size : | 6 mil, 0.15mm | 
| Min. Line Width : | 4/4 mil, 0.10/0.10 mm | 
| Min. Line Spacing : | 4/4mil, 0.10/0.10mm | 
| Application : | Switch device | 
| Certification : | ISO9001, UL, ROHS,TS16949 | 
| Outline profile: | Punching, Routing , CNC routing + V-cut | 
| Solder mask : | LPI Solder mask, Peelable mask | 
| Solder Mask Color : | Blue, black,yellow, matte green | 
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS | 
| Twist and Bow : | no more than 0.75 % | 
 
 PCB Flow Chart.pdf
  
  
 Products Application:
  
 1, Telecom Communication
 2, Consumer Electronics
 3, Security monitor
 4, Vehicle Electronices
 5, Smart Home
 6, Industrial controls
 7, Military & Defense
  
  
 
  
 FAQ :
  
 1. How do ACCPCB ensure quality?
  
 Our high quality standard is achieved with the following.
 1.1 The process is strictly controlled under ISO 9001:2008 standards.
 1.2 Extensive use of software in managing the production process
 1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
 1.4.Dedicated quality assurance team with failure case analysis process
 2. What kinds of boards can ACCPCB process?
     
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
 3. What data are needed for PCB production?
     PCB Gerber files with RS-274-X format.
 4. What’s the typical process flow for multi-layer PCB?
  
 Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.