ITEQ FR4 Tg150 Hdi Circuit Boards Immersion Silver For Medical Equipment

Production description :

this board is 4 layer with 1.0 mm thickness. it is used for medical equipment . PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

Key Specifications/Special Features:

PCB Flow Chart.pdf

Quality Goal:

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Product Application Field :

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

5, Vehicle Electronices: Car etc;

6, Military & Defense : Military Weapons etc;

FAQ

1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.