Specifications
Brand Name :
Guofeng
Model Number :
7.5um
Certification :
UL ISO ROHS
Place of Origin :
China
MOQ :
Negotiation
Price :
$300-$30000
Payment Terms :
L/C,T/T
Supply Ability :
Negotiation
Delivery Time :
Negotiation
Packaging Details :
Standard Packing
Color :
Transparent
Elongation At Break :
150%
Tensile Strength :
50 MPa
Width :
100mm
Thickness :
0.05mm
Surface Finish :
Glossy
Adhesive Type :
Acrylic
Chemical Resistance :
Excellent
Dielectric Strength :
500 V/mil
Material :
Polyester
Temperature Resistance :
Up to 150°C
Flame Retardant :
UL94 V-0
Description

Product Overview

This advanced polyimide coverlay film represents a breakthrough in circuit protection technology, combining a ultra-thin polyimide core (8-25μm) with functional adhesive layers to provide comprehensive protection for high-density circuits. Featuring 50% better flexibility and 40% higher temperature resistance than standard coverlay films, it offers superior solder mask replacement capability while ensuring long-term reliability in demanding applications. The material's unique multi-layer construction provides simultaneous electrical insulation, mechanical protection, and environmental sealing for next-generation electronics.

Breakthrough Performance Advantages

  1. Exceptional Thin-Film Performance

    • Ultra-thin construction (8-25μm) enables bending radii down to 0.1mm

    • 60% improvement in flexibility compared to standard coverlay films

    • Maintains integrity through 100,000+ dynamic flex cycles

  2. Advanced Thermal Management

    • Withstands 10× reflow cycles at 260°C without degradation

    • Continuous service temperature from -269°C to 280°C

    • Thermal conductivity 0.8 W/m·K (3× conventional coverlay materials)

  3. Superior Protection Properties

    • Dielectric strength >6.5 kV/mm for reliable electrical isolation

    • Chemical resistance to fluxes, solvents, and cleaning agents

    • Moisture absorption <0.3% (50% lower than standard films)

  4. Enhanced Processing Characteristics

    • Laser drillable with 15μm via capability for fine-pitch components

    • Excellent dimensional stability (±0.05%) during lamination processes

    • Compatible with automated application equipment for high-volume production

Target Applications

  • High-Density Flexible Circuits

    • Solder mask replacement for fine-pitch BGA and CSP components

    • Protection layer for ultra-thin flexible printed circuits

    • Coverlay for rigid-flex board transition areas

  • Advanced Electronics Packaging

    • Semiconductor device protection and insulation

    • MEMS and sensor packaging encapsulation

    • RF/microwave circuit shielding and protection

  • Demanding Environment Applications

    • Automotive electronics under-hood protection

    • Aerospace and defense circuit protection systems

    • Medical implantable device encapsulation

  • Consumer Electronics

    • Wearable device circuit protection

    • Foldable display circuit insulation

    • High-reliability mobile device circuitry

Product Overview

GB-Type Polyimide Black Film offers excellent thermal stability, electrical insulation, and dimensional reliability. With its opaque black appearance, it is widely used in electronics, flexible circuits, and semiconductor packaging, providing both performance and light-blocking protection.

Product Features

  • lt has extremely high mechanical properties.
    It has an extremely low coefficient of thermal expansion.
  • It has excellent surface bonding properties.
    The product complies with RoHS and Reach requirements and has passed safety certification by the UL laboratory in the United States.

Competitive Differentiation

This coverlay film system redefines circuit protection standards by combining ultra-thin flexibility with robust environmental protection. Unlike conventional solder masks that crack under stress or standard coverlay films that lack precision processing capabilities, this multi-layer system provides complete protection while maintaining the flexibility needed for modern high-density circuit designs. The material's exceptional thermal and chemical resistance ensures reliable performance in the most demanding applications, from automotive under-hood environments to implantable medical devices.

Product pictures

Multilayer Polyimide Protection FPC Film Electrical Insulation Tape OdmMultilayer Polyimide Protection FPC Film Electrical Insulation Tape Odm


Handling & Storage Instructions


To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

  • Shelf Life: 6 months from the date of manufacture.
  • Storage Conditions:

· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.

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Multilayer Polyimide Protection FPC Film Electrical Insulation Tape Odm

Ask Latest Price
Brand Name :
Guofeng
Model Number :
7.5um
Certification :
UL ISO ROHS
Place of Origin :
China
MOQ :
Negotiation
Price :
$300-$30000
Contact Supplier
Multilayer Polyimide Protection FPC Film Electrical Insulation Tape Odm
Multilayer Polyimide Protection FPC Film Electrical Insulation Tape Odm

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Verified Supplier
1 Years
hefei
Since 2021
Business Type :
Manufacturer
Total Annual :
28000-50000
Employee Number :
100~300
Certification Level :
Verified Supplier

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