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Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Specifications
Brand Name :
Guofeng
Model Number :
7.5um
Certification :
UL ISO ROHS
Place of Origin :
China
MOQ :
Negotiation
Price :
$300-$30000
Payment Terms :
L/C,T/T
Supply Ability :
Negotiation
Delivery Time :
Negotiation
Packaging Details :
Standard Packing
Material :
Flexible Printed Circuit Film
Insulation :
Excellent Insulation
Application :
Electronic Devices
Durability :
Long-lasting
Surface Finish :
Smooth
Conductivity :
Highly Conductive
Color :
Transparent
Adhesion :
Strong Adhesion
Flexibility :
Highly Flexible
Description

Flexible Printed Circuit Base Polyimide Substrate Paper Film

Detail Information
Place of Origin:
ANHUI, CHINA
Certification:
UL ISO ROHS
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM 520MM 1028MM 1040MM
Thickness:
12.5μm 20μm 18μm 25μm
Packing Style:
Standard Packing
Application:
Roll Length:
Customized
Packaging Details:
Wooden pallet
Supply Ability:
2000 ton/year
Highlight:
High Thermally Conductive Polyimide Insulation Film for Power Devices
Product Description

Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide

Product Overview

GB-Type Polyimide Black Film offers excellent thermal stability, electrical insulation, and dimensional reliability. With its opaque black appearance, it is widely used in electronics, flexible circuits, and semiconductor packaging, providing both performance and light-blocking protection.

Product Features
  • It has extremely high mechanical properties.
    It has an extremely low coefficient of thermal expansion.
  • It has excellent surface bonding properties.
    The product complies with RoHS and Reach requirements and has passed safety certification by the UL laboratory in the United States.
Product Applications

The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.

Why Choose Our Factory?
  • Direct Manufacturer Pricing: Eliminate intermediaries—competitive costs, flexible MOQs, and fast delivery.
  • Technical Expertise: Customized anti-fog testing for your product, and support to optimize packaging performance.

Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!

Product pictures
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Handling & Storage Instructions

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

  • Shelf Life: 6 months from the date of manufacture.
  • Storage Conditions:

    · Store in a cool, dry place away from direct sunlight will be necessary.

    · Avoid exposure to high humidity or extreme temperature fluctuations.

Tags: Polyimide film
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Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging

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Product Detail
Brand Name :
Guofeng
Model Number :
7.5um
Certification :
UL ISO ROHS
Place of Origin :
China
MOQ :
Negotiation
Price :
$300-$30000
Contact Supplier
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging
Flexible Printed Circuit Base Polyimide Substrate Paper Film Semiconductor Packaging

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Verified Supplier
1 Years
hefei
Since 2021
Business Type :
Manufacturer
Main Products :
PI Material, Polyimide PI Film, Polyimide Thin Film
Total Annual :
28000-50000
Employee Number :
100~300
Certification Level :
Verified Supplier
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