GB Conventional Polyimide Black Film
Our company's GB conventional black polyimide film is specifically engineered as a coverlay for flexible circuit boards requiring structural confidentiality. It retains the excellent insulation, heat resistance, and dimensional stability inherent to polyimide, while its opaque black coloration provides superior shielding. This prevents analysis of underlying circuit patterns. Furthermore, its matte, low-gloss surface minimizes light reflection, preventing glare and reducing the risk of misidentification by customer CCD imaging systems.
Key Advantages: Our company's GB conventional black polyimide film is specifically engineered as a coverlay for flexible circuit boards requiring structural confidentiality. It retains the excellent insulation, heat resistance, and dimensional stability inherent to polyimide, while its opaque black coloration provides superior shielding. This prevents analysis of underlying circuit patterns. Furthermore, its matte, low-gloss surface minimizes light reflection, preventing glare and reducing the risk of misidentification by customer CCD imaging systems.
Product application: GB-standard opaque polyimide masking membranes are primarily deployed as cladding layers for flexible printed circuitry, electromagnetic shielding barriers, lithium-ion battery interconnection assemblies, and high-density insulation systems. Place of Origin:
ANHUI, CHINA
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Product Features
This molecularly engineered composite exhibits groundbreaking mechanical integrity with superior crack propagation resistance and extended operational longevity, augmented by exceptional dimensional invariance originating from its ultralow coefficient of thermal expansion (CTE < 5 ppm/K). The material demonstrates elite interfacial adhesion properties enabling fault-tolerant device integration, while achieving certified compliance with global hazardous materials directives (EU RoHS 3) and chemical substance registration frameworks (REACH Annex XVII). Additionally, it possesses multi-jurisdictional safety accreditation from the International Electrotechnical Commission (IEC) and Underwriters Laboratories certification for cross-border deployment. Product Applications
Acting as critical facilitation platforms for next-wave electronic applications, Generation-Leadership specification polyimide composites deliver architecture-vital performance benchmarks across:
1) sub-micrometer precision laminated flex-circuit assemblies
2) geometrically stable protective interface matrices
3) vanguard chip-scale integration environments
4) application-optimized bonding films with tunable rheological properties