Stealth-Specification GC Series Submicron Opacity Polyimide Substrate
The GB-series nanoscale opaque polyimide substrate demonstrates outstanding fracture toughness, solvent resistance, thermal resilience exceeding 500°C, and complete electromagnetic spectrum attenuation, positioning it as an optimal solution for infrared-suppressive bonding systems, thermally stable covert identification tags, and radar-absorbing protective interfaces.
Key Advantages: Engineered for discrete electronics applications, our proprietary GB-series opaque polyimide cladding is formulated specifically for security-sensitive flexible circuit architectures. This specialized overlay maintains polyimide's characteristic dielectric strength, thermal endurance (>400°C), and mechanical stability while integrating permanent blackout properties that effectively obstruct visual and optical circuit analysis. The anti-reflective matte surface treatment (60° gloss <5 GU) eliminates specular reflection, ensuring reliable machine vision inspection accuracy by preventing CCD misinterpretation.
Product application: GB-classified lightlock polyimide veiling substrates are strategically implemented as encryption-grade encapsulation for:
1) pliable electronic matrixes
2) electromagnetic pulse attenuation interfaces
3) high-voltage electrochemical cell interposers
4) quantum computing insulation regimes Place of Origin:
ANHUI, CHINA
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Product Features
This molecularly engineered composite exhibits groundbreaking mechanical integrity with superior crack propagation resistance and extended operational longevity, augmented by exceptional dimensional invariance originating from its ultralow coefficient of thermal expansion (CTE < 5 ppm/K). The material demonstrates elite interfacial adhesion properties enabling fault-tolerant device integration, while achieving certified compliance with global hazardous materials directives (EU RoHS 3) and chemical substance registration frameworks (REACH Annex XVII). Additionally, it possesses multi-jurisdictional safety accreditation from the International Electrotechnical Commission (IEC) and Underwriters Laboratories certification for cross-border deployment. Product Applications
The GB-series submicron opaque polyimide matrix is strategically implemented in:
1) electromagnetic wave-transparent cladding for resonant power transfer systems
2) electrochemical interface layers for high-voltage energy storage modules
3) thermal-enduring covert marking systems for industrial authentication
4) multi-layer dielectric separation media for high-frequency electronics.