The OK-TH6-500 is a professional 6-tank automatic solder paste thawing machine designed for precise temperature-controlled rewarming of solder paste jars. Each tank features independent PID temperature control and an integrated FIFO timer, ensuring every jar achieves the correct temperature before use — eliminating viscosity-related printing defects caused by cold paste.
| Parameter | Value |
|---|---|
| Number of Tanks | 6 independent slots |
| Tank Capacity | 500g standard jar per tank |
| Temperature Control | PID independent per tank |
| Temperature Stability | ±0.5°C |
| Display | LED digital per tank |
| FIFO Function | Yes with countdown timer plus alarm |
| Power Supply | AC 110V/220V, 50/60Hz |
| Dimensions | 480*420*280mm |
Essential companion equipment for any SMT line using refrigerated solder paste. Eliminates condensation on cold paste jars, restores proper viscosity for consistent stencil printing, and prevents paste oxidation from premature opening. Recommended for lines running fine-pitch 0201/01005 and micro BGA assembly.
Standard export packaging with double-wall corrugated box and custom foam insert. Fast delivery in 3-7 working days. Bulk order discounts available for multi-machine purchases.