OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer
The OK-SP460-C is equipped with an integrated three-mode automatic stencil cleaning system (dry, wet, and vacuum) that maintains stencil aperture integrity through extended production runs. By eliminating manual stencil wiping, it reduces downtime, improves print consistency, and extends stencil service life.
Key Features
- Three-Mode Cleaning: Dry wipe removes residual paste, wet cleaning dissolves hardened deposits, and vacuum extraction removes debris automatically
- Programmable Frequency: Set cleaning intervals from every 1 to 99 prints based on paste type and production requirements
- 400mm Paper Roll: Large-capacity cleaning paper roll supports full-shift unmanned operation
- Bottom-Side Cleaning: Dedicated underside cleaning mechanism prevents paste buildup that causes bridging defects
- Solvent Management: Precision solvent dispensing with low-level sensor alarm prevents dry-wipe cleaning damage to stencils
- CCD Vision Alignment: Accurate registration maintained throughout cleaning cycles with automatic recalibration
Technical Specifications
| Parameter |
Value |
| Cleaning Modes |
Dry, Wet, Vacuum |
| Cleaning Paper Width |
400mm roll |
| Cleaning Frequency |
Programmable, 1-99 prints |
| Max PCB Size |
510*340mm |
| Min PCB Size |
50*50mm |
| Repeat Accuracy |
±15μm |
| Printing Accuracy |
±30μm |
| Cycle Time |
under 10s |
Applications
Suitable for 24/7 high‑volume SMT production lines with Type 4/5 fine‑pitch solder paste, to avoid printing defects caused by stencil clogging. Widely applied in automotive electronics and smartphone assembly scenarios requiring high production yield.
Packaging and Shipping
Packed in standard export wooden crate, with separate space for cleaning consumables including initial roll. Delivery within 7‑15 working days.