The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.
Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.
Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.
| Attributes | Attribute value |
|---|---|
| Product Name | SMT Solder Paste Mixer |
| Core Function | Solder Paste Stirring & Mixing |
| Feature | Uniform Mixing Performance |
| Equipment Type | SMT Auxiliary Equipment |
| Application | SMT PCB Printing Process |
| Condition | New |
| Origin | China |