Specifications
Payment Terms :
T/T
Test Functions :
Viscosity Slump Tack Solder Ball
Display :
LCD digital with data export
Temperature Range :
Ambient to 250 degree C
Model Number :
OK-XGJBJ
Power Supply :
AC 110V/220V 50/60Hz
Condition :
New
MOQ :
1 Set
Delivery Time :
3-7 working days
Sample Size :
Standard 500g jar compatible
Origin :
China
Price :
open to negotiation
Test Standards :
IPC-TM-650 JIS Z 3284
Certification :
ISO 9001
Feature :
Uniform Mixing Performance
Supply Ability :
500 Sets per Month
Machine Model :
OK-QC500
Packaging Details :
Standard export carton with foam insert, calibrated test fixtures included, double-wall corrugated packaging
Product Name :
SMT Solder Paste Mixer
Brand Name :
Okai Intelligent Technology Co., Ltd.
Dimensions :
350×300×200mm
Equipment Type :
SMT Auxiliary Equipment
Application :
SMT PCB Printing Process
Place of Origin :
Guangdong, China
Core Function :
Solder Paste Stirring & Mixing
Description

OK-QC500 Solder Paste Aging Inspection Tester

The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.

Key Features

  • Viscosity Test: Measures paste viscosity after rewarming against manufacturer specifications to verify proper flow characteristics for stencil printing
  • Slump Test: Evaluates paste shape retention after printing — cold or over-aged paste that spreads laterally will be detected before causing bridging defects
  • Tack Test: Quantifies paste tackiness to ensure adequate component hold force during placement and transport before reflow
  • Solder Ball Test: Identifies paste degradation by checking for excessive solder ball formation during reflow — a key indicator of expired or improperly stored paste
  • IPC-TM-650 and JIS Z 3284 Compliant: Test protocols aligned with international industry standards for auditable quality records

Applications

Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.

Packaging and Shipping

Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.

Attributes
Attributes Attribute value
Product Name SMT Solder Paste Mixer
Core Function Solder Paste Stirring & Mixing
Feature Uniform Mixing Performance
Equipment Type SMT Auxiliary Equipment
Application SMT PCB Printing Process
Condition New
Origin China


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SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine

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Payment Terms :
T/T
Test Functions :
Viscosity Slump Tack Solder Ball
Display :
LCD digital with data export
Temperature Range :
Ambient to 250 degree C
Model Number :
OK-XGJBJ
Power Supply :
AC 110V/220V 50/60Hz
Contact Supplier
video
SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine
SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine
SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine
SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine

Guangdong Okai Intelligent Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, dongguan
Since 2008
Business Type :
Manufacturer, Exporter
Total Annual :
10000000-20000000
Employee Number :
90~150
Certification Level :
Verified Supplier
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