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Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Specifications
Brand Name :
ZMSH
Model Number :
Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Payment Terms :
T/T
Supply Ability :
1000pcs per month
Delivery Time :
3-6 months
Packaging Details :
package in 100-grade cleaning room
Project :
Multi-line wire saw with workbench on top
Diamond wire diameter :
0.1-0.5mm
Wire running speed :
2000 (MIX) m/min
Vertical lifting stroke of workstation :
250mm
Water tank :
300L
Total power of machine tool :
≤92kW
Cutting method :
The material sways and descends from top to bottom, while the position of the diamond line remains unchanged
Description

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine equipment introduction

​​Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​

The diamond wire single/multi-wire high-speed high-precision descending/swinging cutting machine is a ​​composite processing equipment for hard and brittle materials​​. By combining ​​dynamic grinding of diamond wire​​ (steel wire coated with silicon carbide/aluminum oxide particles) and ​​multi-axis coordinated control​​, it achieves ​​high-precision cutting​​ of ultra-hard materials. Key design features include:

  • ​​Multi-wire cutting​​: Utilizes multiple diamond wires simultaneously to enhance material utilization and efficiency.
  • ​​High-speed motion​​: Wire speed up to 2400 m/min, significantly reducing processing time.
  • ​​High-precision control​​: Servo/stepper motor-driven with ±0.01 mm cutting accuracy.
  • ​​Swinging cutting​​: Worktable oscillates ±5°–±8° to optimize surface flatness.
  • ​​Descending feed​​: Vertical movement of the workpiece or wire minimizes material stress damage.

This equipment is widely used in ​​semiconductors, photovoltaics, ceramics, gemstones, and medical fields​​, particularly for cutting ​​silicon carbide (SiC), sapphire, monocrystalline silicon, and quartz glass​​.

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine technical specifications


Parameter Specification
Project Multi-line wire saw with workbench on top
Maximum workpiece size ø 204*500mm
Main roller coating diameter (Fixed at both ends) ø 240*510mm (two main rollers)
Wire running speed 2000 (MIX) m/min
Diamond wire diameter 0.1-0.5mm
Line storage capacity of supply wheel 20 (0.25 Diamond wire diameter) km
Cutting thickness range 0.1-1.0mm
Cutting accuracy 0.01mm
Vertical lifting stroke of workstation 250mm
Cutting method The material sways and descends from top to bottom, while the position of the diamond line remains unchanged
Cutting feed speed 0.01-10mm/min
Water tank 300L
Cutting fluid Anti-rust high-efficiency cutting fluid
Swing speed 0.83°/s
Air pump pressure 0.3-3MPa
Swing angle ±8°
Maximum cutting tension 10N-60N (Set minimum unit 0.1N)
Cutting depth 500mm
Workstation 1
Power supply Three-phase five-wire AC380V/50Hz
Total power of machine tool ≤92kW
Main motor (Water circulation cooling) 22*2kW
Wiring motor 1*2kW
Workbench swing motor 1.3*1kW
Tension control motor (Water circulation cooling) 5.5*2kW
Wire release and collection motor 15*2kW
External dimensions (excluding rocker arm box) 1320*2644*2840mm
External dimensions (including rocker arm box) 1780*2879*2840mm
Machine weight 8000kg

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine working principle

Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment

The machine operates on ​​"dynamic grinding of diamond wire + multi-axis synchronization"​​:

​​1. Diamond Wire Cycling​​:

  • A high-speed rotating capstan drives diamond wire in ​​reciprocating or unidirectional motion​​.
  • Tension wheels (pneumatic/spring-loaded) maintain wire tension (0.1–1.0 MPa), while guide wheels ensure stability.

2. ​​Material Feeding​​:

  • ​​Descending feed​​: Workpiece platform moves vertically at 0.01–10 mm/min, or wire actively presses against the workpiece.
  • ​​Swinging cutting​​: Worktable oscillates laterally (±15 mm amplitude) to prolong contact time and improve surface roughness.

​​3. Multi-wire Coordination​​:

  • Multiple diamond wires are synchronized via a tensioning system for ​​continuous cutting of large-sized materials​​ (e.g., Φ300×300 mm workpieces).

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine key features & advantages​

​​Feature​​

​​Description​​

​​High Efficiency​​

Multi-wire parallel processing + 2400 m/min speed, 300% productivity gain

​​Ultra-High Precision​​

Servo/stepper motors + ball screws ensure ±0.01 mm accuracy​​

​​Low Damage​​

Descending feed + swinging motion minimize stress concentration, <5 μm edge chipping

​​Intelligent Control​​

PLC + touchscreen for program presetting, real-time monitoring, and break-resume

​​Eco-Friendly​​

Water-based cutting fluids reduce dust; noise <70 dB

​​Material Compatibility​​

Processes materials ≤Mohs 9.5 hardness (diamond wire: hardness 10)

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine application

Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment

1. Semiconductors & Photovoltaics​​:

  • ​​Silicon Wafer Slicing​​: Monocrystalline/multicrystalline silicon ingot squaring/slicing (50–300 μm thickness) for solar cells and ICs.
  • ​​SiC Wafer Cutting​​: High-purity SiC wafers for EV power devices, <10% material loss.

​​2. Ceramics & Gemstones​​:

  • ​​Sapphire Processing​​: LED substrate and smartphone screen slicing with ±0.02 mm thickness uniformity.
  • ​​Zirconia Ceramics​​: Mobile phone backplates and cutting tools with Ra<1.6 μm surface roughness.

3. ​​Quartz & Optical Glass​​:

  • ​​Quartz Crystals​​: Oscillator and sensor slicing (±0.01 mm precision).
  • ​​Infrared Glass​​: Thermal imaging lens fabrication to avoid thermal deformation.

4. ​​Biomedical & Research​​:

  • ​​Orthopedic Implants​​: Hip joint and dental specimen slicing with no thermal damage.
  • ​​Geological Thin Sections​​: 0.2–2 mm mineral slices preserving original structure.

5. ​​Composites & Metals​​:

  • ​​Carbon Fiber Composites​​: Aerospace component cutting with <5% fiber breakage.
  • ​​Titanium Alloys​​: Medical device machining with 0.1–0.3 mm kerf width.

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine FAQ

1. Q: ​​What are the core advantages of diamond wire dual-station cutting machines?​​

​​ A:​​ ​​High-speed dual-station design​​ enables simultaneous processing of two workpieces, doubling efficiency while maintaining ​​±0.01 mm precision​​ for materials like silicon wafers and ceramics.

2. Q: ​​How does a diamond wire saw achieve "descending/swinging cutting"?​​

​​ A:​​ It combines ​​vertical feed systems​​ (descending motion) and ​​oscillating worktables​​ (±5°–8° swings) to reduce material stress and improve surface flatness, ideal for brittle materials like sapphire and SiC.

Tags: #Diamond Wire Cutting Machine, #Multi-Wire, #High-Speed, #High-Precision,#Descending, #Oscillatin, #Hard Brittle Materials​​

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Product Detail
Brand Name :
ZMSH
Model Number :
Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Contact Supplier
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Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment

SHANGHAI FAMOUS TRADE CO.,LTD

Verified Supplier
8 Years
shanghai, shanghai
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company
Main Products :
Gallium Nitride Wafer, Sapphire Wafer, SiC Substrate
Total Annual :
1000000-1500000
Certification Level :
Verified Supplier
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