MachineU > China Products > Chemicals
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
Specifications
Brand Name :
ZMSH
Model Number :
Diamond Wire Triple-Station Single-Wire Cutting Machine
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Payment Terms :
T/T
Supply Ability :
1000pcs per month
Delivery Time :
3-6 months
Packaging Details :
package in 100-grade cleaning room
Model :
Three station diamond single line cutting machine
Wire running speed :
1000 (MIX) m/min
Diamond wire diameter :
0.25-0.48mm
Cutting accuracy :
0.01mm
Water tank :
150L
Swing angle :
±10°
Workstation :
3
Description

Diamond Wire Triple-Station Single-Wire Cutting Machine Equipment Introduction​

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

The diamond wire triple-station single-wire cutting machine is a ​​multi-station collaborative processing system​​ designed for high-precision, high-efficiency cutting of hard and brittle materials such as sapphire, jade, and ceramics. Its core components include:

  • ​​Triple-station layout​​: Separated zones for cutting, wire spooling/releasing, and operation/maintenance enhance operational safety and continuity.
  • ​​Servo-driven system​​: Servo motors control wire spooling, tensioning, and feeding, ensuring ±0.01 mm motion precision.
  • ​​Closed-loop tension control​​: Real-time monitoring and adjustment of wire tension (0.1–1.0 MPa) to prevent breakage.
  • ​​Intelligent features​​: Integrated cloud connectivity and remote monitoring for predictive maintenance and fault alerts.

Diamond Wire Triple-Station Single-Wire Cutting Machine Technical Specifications


Model Three station diamond single line cutting machine
Maximum workpiece size 600*600mm
Wire running speed 1000 (MIX) m/min
Diamond wire diameter 0.25-0.48mm
Line storage capacity of supply wheel 20km
Cutting thickness range 0-600mm
Cutting accuracy 0.01mm
Vertical lifting stroke of workstation 800mm
Cutting method The material is stationary, and the diamond wire sways and descends
Cutting feed speed 0.01-10mm/min (According to the material and thickness)
Water tank 150L
Cutting fluid Anti rust high-efficiency cutting fluid
Swing angle ±10°
Swing speed 25°/s
Maximum cutting tension 88.0N (Set minimum unit0.1n)
Cutting depth 200~600mm
Make corresponding connecting plates according to the customer's cutting range -
Workstation 3
Power supply Three phase five wire AC380V/50Hz
Total power of machine tool ≤32kw
Main motor 1*2kw
Wiring motor 1*2kw
Workbench swing motor 0.4*6kw
Tension control motor 4.4*2kw
Wire release and collection motor 5.5*2kw
External dimensions (excluding rocker arm box) 4859*2190*2184mm
External dimensions (including rocker arm box) 4859*2190*2184mm
Machine weight 3600ka

Diamond Wire Triple-Station Single-Wire Cutting Machine Working Principle

The machine operates via ​​dynamic diamond wire grinding + triple-station synchronization​​:

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

​​1. Wire Cycling​​:

  • Diamond wire (0.25–0.48 mm diameter) winds on a capstan, moving reciprocally at 1000 m/min to generate grinding trajectories.
  • Servo-driven tension wheels maintain constant tension, while guide wheels stabilize the wire network.

​​

2. Material Feeding​​:

  • The worktable moves vertically (800 mm stroke) at 400–1200 mm/h, or the wire actively presses against the workpiece.
  • Triple-station alternating operations: Cutting proceeds in one zone while others handle loading/unloading, minimizing downtime.

​​

3. Multi-axis Coordination​​:

  • X/Y/Z-axis synchronization enables 360° rotation and ±15° tilt of the workpiece for complex geometries.

Diamond Wire Triple-Station Single-Wire Cutting Machine Key Features & Advantages​

​​Feature​​

​​Description​​

​​Technical Parameters/Examples​​

​​Ultra-High Precision​​

Servo motors + ball screws ensure ​​±0.01 mm accuracy​​

Workpiece size: ø600×600 mm

​​High Efficiency​​

Triple-station parallel processing boosts productivity by ​​200%​​

Cutting speed: 400–1200 mm/h

​​Low Damage​​

Pneumatic tensioning (0–1 MPa) + oscillating motion reduce edge chipping

Sapphire edge chipping <3 μm

​​Smart Controls​​

PLC + touchscreen for preset programs, break detection, and cloud maintenance

Tension anomaly alerts

​​Eco-Friendly​​

Water-based lubricants reduce dust; noise <70 dB

Compliant with RoHS standards

​​Material Compatibility​​

Processes materials ≤Mohs 9.5 hardness (e.g., SiC: Mohs 9.2)

Sapphire, jade, ceramics

Diamond Wire Triple-Station Single-Wire Cutting Machine Applications

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

1. Semiconductors & Photovoltaics​​:

  • ​​Silicon Wafer Cutting​​: Monocrystalline/multicrystalline silicon ingot squaring/slicing (50–300 μm) for solar cells and ICs.
  • ​​SiC Wafer Processing​​: High-purity SiC wafers for EV power devices, <10% material loss.

​​2. Ceramics & Gemstones​​:

  • ​​Sapphire Substrates​​: LED and smartphone screen cutting with ±0.02 mm thickness uniformity.
  • ​​Zirconia Ceramics​​: Mobile phone backplates and tools with Ra<1.6 μm surface roughness.

​​3. Composites & Metals​​:

  • ​​Carbon Fiber Composites​​: Aerospace component cutting with <5% fiber breakage.
  • ​​Titanium Alloys​​: Medical device machining (0.1–0.3 mm kerf width).

4. ​​Biomedical & Research​​:

  • ​​Orthopedic Implants​​: Hip joint and dental specimen slicing with no thermal damage.
  • ​​Geological Thin Sections​​: 0.2–2 mm mineral slices preserving original structure.

Diamond Wire Triple-Station Single-Wire Cutting Machine FAQ

1. Q: ​​What makes diamond wire triple-station single-wire cutting machines ideal for industrial applications?​​

​​ A:​​ ​​Closed-loop tension control​​ and ​​servo-driven synchronization​​ ensure ±0.01 mm precision and 200% efficiency gains for cutting sapphire, ceramics, and hard-brittle materials.

2. Q: ​​How does a triple-station diamond wire cutter reduce material waste?​​

​​ A:​​ Its ​​multi-station workflow​​ minimizes downtime by alternating cutting, loading, and unloading, while ​​oscillating motion​​ optimizes material usage for thin-wafer production.

Tags: #Diamond Wire Triple-Station Single-Wire Cutting Machine, #SiC/Sapphire/Silicon Processing, #Sapphire, #Ceramics​​

Send your message to this supplier
Send Now

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

Ask Latest Price
Watch Video
Product Detail
Brand Name :
ZMSH
Model Number :
Diamond Wire Triple-Station Single-Wire Cutting Machine
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Contact Supplier
video
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​

SHANGHAI FAMOUS TRADE CO.,LTD

Verified Supplier
8 Years
shanghai, shanghai
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company
Main Products :
Gallium Nitride Wafer, Sapphire Wafer, SiC Substrate
Total Annual :
1000000-1500000
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Semiconductor Equipment
MachineU China Products Chemicals
Contact Supplier
Submit Requirement