​​High-Precision Multi-Wire Cutting Equipment for Mass Production of Sapphire Materials​​

The multi-wire cutting machine is a specialized device that utilizes ​​high-speed reciprocating metal wires to carry diamond abrasives​​, enabling ​​large-volume, high-precision slicing​​ of hard and brittle materials. Specifically designed for sapphire—a material characterized by ​​high hardness (Mohs hardness up to 8.5) and high brittleness​​—multi-wire cutting technology has become the core process for preparing sapphire wafers and substrates. It effectively addresses the limitations of traditional cutting methods, such as ​​low efficiency, high material loss, and poor surface quality​​.

Multi-wire Cutting Machine Working Principle​

During operation, ​​extremely fine diamond wires​​ are tensioned under precise control and guided by a system of rollers to form a large "wire web." The sapphire ingot is driven by a worktable and fed into this web. Through the ​​high-speed movement of the wires, abrasives (typically diamond) are carried into the cutting zone to grind the sapphire​​, allowing the entire ingot to be sliced into hundreds or even thousands of thin sheets simultaneously in a single pass. Advanced equipment incorporates a ​​swinging motion​​, which reduces the contact length between the wire and the workpiece, thereby enhancing cutting stability and minimizing cutting forces.

Multi-wire Cutting Machine Characteristics & Advantages​

Multi-wire Cutting Machine Applications​

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About ZMSH

ZMSH provide comprehensive services for multi-wire cutting equipment specifically designed for sapphire materials, including ​​customized processing solutions​​ tailored to client specifications (e.g., adapting to unique sapphire ingot dimensions or cutting precision requirements) and ​​direct sales and supply of high-performance cutting systems​​. Our integrated support covers equipment parameter optimization, process development, and full-cycle technical assistance to ensure seamless integration into production lines, leveraging technologies such as adaptive tension control and modular designs for diverse industrial applications.

1. Q: How to operate a wire cutting machine?​​

A: Operating a Wire Cutting Machine​​: Follows the standard procedure of ​​power-on inspection, parameter setting, test cut verification, formal machining, and shutdown maintenance​​ to ensure precision and safety.

2. Q: What is the principle of a wire cutting machine?​​

A: Principle of a Wire Cutting Machine​​: Utilizes ​​pulse spark discharge generated between a continuously moving thin metal wire (electrode wire) and the workpiece​​ for electro-erosion machining (EDM principle), or employs a ​​high-speed moving wire carrying abrasives​​ to grind and cut hard and brittle materials.

3.Q: What materials can a multi-wire cutting machine process?

A: These machines are designed for ​​hard and brittle materials​​, including sapphire, silicon, quartz crystals, optical glass, ceramics, and various metals and alloys used in semiconductor and solar panel manufacturing.

Tags: #Multi-Wire Cutting Equipment, #Customized, #​​High-Precision, #Mass Production, #Sapphire Materials