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​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
Specifications
Brand Name :
ZMSH
Model Number :
Ceramic Cutting Equipment
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Payment Terms :
T/T
Delivery Time :
3-6 months
Packaging Details :
package in 100-grade cleaning room
Type :
Single-Wire/Multi-Wire
Wire Diameter (per wire)​​ :
0.10–0.35 mm
Tension Control Precision​​ :
±0.1 N
Material Utilization​​ :
≥85%
Power Requirement​​ :
1.5–17.8 kW
Cutting Speed (Feed Rate)​​ :
0.01–9.99 mm/min
Description

Ceramic Cutting Equipment Overview

​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

Ceramic cutting equipment is categorized into ​​single-wire cutting machines​​ and ​​multi-wire cutting machines​​, specifically designed for hard and brittle ceramic materials.

  • ​​Single-Wire Cutting Machine​​: Utilizes a single diamond-coated wire for unidirectional or reciprocating motion cutting, ideal for small batches and high-precision scenarios (e.g., laboratories, precision component processing).
  • ​​Multi-Wire Cutting Machine​​: Employs multiple diamond-coated wires arranged in a dense network to achieve batch slicing, with efficiency ​​50% higher​​ than single-wire systems, suitable for industrial mass production.

​​Applicable Materials​​: Aluminum oxide (Al₂O₃), aluminum nitride (AlN), silicon carbide (SiC), zirconia (ZrO₂), glass, crystals, and other brittle materials.

Ceramic Cutting Equipment ​​Working Principle​

​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

Single-Wire Cutting Equipment​​

  • ​​Working Principle​​: Driven by a motor, a single diamond wire reciprocates at high speed, grinding the ceramic surface with abrasive particles while maintaining wire tension stability via a tensioning system.
  • ​​Key Parameters​​: Linear speed range: 0–2 m/s; Tension control accuracy: ±2 N.

​​Multi-Wire Cutting Equipment​​

  • ​​Working Principle​​: Multiple diamond wires form a dense wire network on guide wheels. Servo systems precisely regulate linear speed (300–1,500 m/min) and tension, with cutting fluid carrying abrasives to complete synchronous grinding and cutting.
  • ​​Key Parameters​​: Diamond wire diameter: 0.1–0.25 mm; Cutting thickness error: ≤0.012 mm.

Ceramic Cutting Equipment Features & Advantages​

​​Feature​​

​​Single-Wire Cutting Machine​​

​​Multi-Wire Cutting Machine​​

​​Precision​​

 Cutting thickness error ≤0.1 mm, surface roughness Ra ≤1.6 μm Cutting thickness error ≤0.012 mm, surface roughness Ra ≤0.8 μm

​​Efficiency​​

 Suitable for small sizes (≤100×100 mm), 10–30 minutes per cut Processes hundreds of slices per cycle (e.g., 300×300 mm workpieces)

​​Material Loss​​

 Kerf width: 0.3–0.5 mm, material utilization ~70% Kerf width: ~0.01 mm wider than wire diameter, utilization up to 85%

​​Automation​​

 Basic manual/semi-automatic operation with manual parameter adjustments Fully automated control with tension alerts, fault diagnostics

​​Application Scope​​

 Laboratories, high-value small batches (e.g., semiconductor wafers, bioceramics) Industrial lines, mass production (e.g., LED substrates, EV ceramic PCBs)

Ceramic Cutting Equipment Applications​

  • ​​Electronics Field​​: Primarily used for cutting aluminum nitride (AlN) and zirconia (ZrO₂) ceramic substrates, with typical cases such as precision processing of 5G communication filter substrates.

  • ​​Semiconductor Packaging Field​​: Suitable for cutting aluminum oxide (Al₂O₃) ceramic packaging casings, with typical cases including chipping-free processing of chip packaging casings.

  • ​​New Energy Field​​: Targets cutting of silicon carbide (SiC) ceramic substrates, with typical applications such as production of heat dissipation substrates for new energy vehicle IGBT modules.

  • ​​Medical Device Field​​: Specializes in processing zirconia (ZrO₂) dental implants, with typical cases like high-precision cutting of bioceramic implants.

​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

Ceramic Cutting Equipment Q&A

Q1: What is the main difference between single-wire and multi-wire ceramic cutting machines?​​

​​A1:​​ Single-wire machines use one diamond wire for small-batch, high-precision cuts (e.g., lab samples), while multi-wire machines employ multiple parallel wires for high-throughput industrial production with lower material waste.

​​Q2: Why choose multi-wire cutting for ceramic mass production?​​

​​A2:​​ Multi-wire systems achieve 30%+ higher efficiency, tighter kerf widths (<0.01 mm), and near-zero chipping, making them ideal for large-scale ceramic substrate manufacturing.


Tags: #Ceramic Cutting Equipment, #Customized, #​​High-Precision, #Diamond Wire, #High-Precision Slicing​​, #Single-Wire/Multi-Wire ,#​Diamond Wire Cutting

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​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

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Product Detail
Brand Name :
ZMSH
Model Number :
Ceramic Cutting Equipment
Certification :
rohs
Place of Origin :
CHINA
MOQ :
3
Price :
by case
Contact Supplier
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting
​Ceramic Cutting Equipment Single-Wire/Multi-Wire Diamond Wire Cutting

SHANGHAI FAMOUS TRADE CO.,LTD

Verified Supplier
8 Years
shanghai, shanghai
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company
Main Products :
Gallium Nitride Wafer, Sapphire Wafer, SiC Substrate
Total Annual :
1000000-1500000
Certification Level :
Verified Supplier
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