12-Inch High-Speed Diamond Wire Cutting Machine for Sapphire, SiC, Ceramics, and More

Product Overview:

The Machine is a high-speed, high-precision diamond wire multi-wire cutting machine developed for cutting 12-inch semiconductor sapphire substrates. It is widely applicable for large-sized and ultra-thin cutting of materials such as silicon carbide (SiC), sapphire, ceramics, precious metals, quartz, and optical glass. This cutting-edge equipment is designed to deliver exceptional precision, speed, and efficiency, making it ideal for industries such as semiconductor, optics, electronics, and other high-precision manufacturing fields.

Key Features:

• Maximum Cutting Size: Capable of cutting up to 12 inches (∅310*500mm) of material.

• High Speed and Precision: The diamond wire operates at a maximum speed of 2500 meters per minute, with a cutting accuracy of 0.01mm, ensuring high efficiency and precision for advanced manufacturing.

• Swinging Cutting Method: The material swings and descends from top to bottom while the diamond wire remains stationary, providing smooth and accurate cuts.

• Multi-Wire Cutting: The machine supports multi-wire cutting technology, significantly enhancing production efficiency.

• Wide Cutting Thickness Range: The cutting thickness ranges from 0.1mm to 20mm, making it versatile for a wide range of applications.

Technical Specifications:

Applications:

The Machine is designed for high-precision cutting in industries such as semiconductors, optics, and precious metal processing. It is ideal for large-scale, ultra-thin cutting of hard and brittle materials such as sapphire and silicon carbide (SiC), offering both precision and efficiency for advanced manufacturing needs. This cutting machine provides excellent performance in both research and high-volume production environments.

Related Product:

Small-Scale Multi-Wire Diamond Wire Cutting Machine for Stone