2mm 2pin Female Pin Header Vertical DIP Single Row 1*2P Female 2.0mm Pin Header Connector

Highlight

• 2.0 mm pitch, single‑row 2‑position vertical DIP through‑hole mounting, compact footprint for simple signal / low‑power jump connection
• Phosphor‑bronze spring contacts, stable gripping force, anti‑loosen under slight vibration conditions
• UL94V‑0 high‑temperature black insulator, compatible with standard wave‑soldering process
• Flexible plating options: tin/flash gold / selective gold; RoHS & REACH compliant for global OEM sourcing
• Drop‑in replacement for mainstream 2.0 mm pitch industry standard female header series, short lead‑time for mass production

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Single row 2‑pin vertical straight DIP through‑hole design, simple 2‑line connection solution
2. Phosphor‑bronze spring contact beam, consistent contact pressure, reduces intermittent signal risk under vibration
3. Black high‑temperature UL94V‑0 plastic housing, resistant to soldering thermal shock, no melting or deformation during wave solder
4. Multiple contact surface finishes optional: tin plating, nickel base with flash gold, selective gold plating for different cycle‑life requirements
5. Standard footprint, directly compatible with mainstream 2.0 mm pitch male pin header mates
6. RoHS‑compliant raw material, supports consumer & industrial finished‑product certification

Product Advantage

1. DIP mechanical reliability: Through‑hole soldering provides far stronger PCB retention than SMT version; suitable for assemblies subject to plug‑unplug stress or minor vibration
2. Targeted 2‑pin configuration: Optimized for power‑ground pair, simple trigger signal links; avoids redundant pins for minimal PCB space occupation
3. Spring‑tuned phosphor‑bronze contact: Better contact stability than ordinary brass terminals; reduces field failure caused by poor contact in a vibration environment
4. Cost‑flexible plating solution: Tin plating for mass‑cost‑sensitive consumer goods; flash / selective gold for industrial high‑mating‑cycle devices, no over‑spec cost waste
5. Standard interoperability: Footprint and mating dimension follow industry‑wide 2.0 mm pitch norms, easy BOM substitution without PCB redesign

Application

• IoT sensor modules & wireless control units
• Embedded controller boards, auxiliary signal interfaces
• Household smart appliances, small control circuit boards
• Industrial auxiliary signal terminals, low‑power board‑jumper connection
• Test fixture, prototype development hardware

Customization Options

1. Confirm mating part: must pair with 2.0 mm pitch single‑row male pin header; mismatched pitch will cause assembly damage and bad contact
2. Mounting: choose this DIP vertical version when strong mechanical holding is required; switch to SMT variant if you need full surface‑mount assembly
3. Plating selection:
   • Tin plating: low‑cost consumer product, few mating cycles
   • Nickel+Flash gold: industrial equipment, frequent plug‑in, humid operating environment
4. Electrical derating: under continuous working & high‑ambient‑temperature condition, derate current to ≤ 70 % of rated value
5. PCB footprint: strictly follow our dimension drawing; do not modify pad size arbitrarily to prevent cold solder or tomb‑stoning
6. If you need more positions, we support 1×3P‑1×40P single‑row female header customization