MachineU > China Products > Machinery > Electronics Production Machinery
TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ
TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ
Specifications
Model Number :
TS650RN
Brand Name :
KHJ
Color :
white translucent
Total Thickness :
0.153±0.005mm
Certification :
ROHS
Place of Origin :
ShenZhen China
Description
Description
TS650RN is a white translucent thermal separation tape with high initial viscosity. At a certain temperature (110~140℃), the adhesive surface foams
and viscosity disappears, allowing automatic separation from the adhered object.
Construction
TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ
Features
* Easily peeled off by heat treatment at any time
* Initial temperature resistance and will not Anti-stick
* RoHS Compliant
Application
* This product is suitable for temporarily fixing various types of components,ceramics, glass, metal plates, etc.
Properties

Item Typical Value Test Method
Imperial Metric
Backing 4.0mil 0.1mm /
Total Thickness 6.12mil 0.153±0.005mm /
Adhesion Before heating 1.2-1.87lbs/in 5.5-8.5N/25mm GBT 2792-2014
After heating 0 0
Tensile Strength ≥55bs/in ≥10(KN/M) GBT 30776-2014
Elongation ≥120% ≥120% GBT 30776-2014

Recommended debonding process: 130℃*3-15min(based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)

Storage

* Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

* Shelf life: 12 months from the date of manufacture when stored in initial packing.

Precaution Reminder

* Surface should be clean, dry, free of dust, oil or other contaminants.

* Proper pressure required by roller, hand or press when applying.

* Avoid repeat sticking to prevent adhesion decrease.

Notes

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

Send your message to this supplier
Send Now

TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

Ask Latest Price
Product Detail
Model Number :
TS650RN
Brand Name :
KHJ
Color :
white translucent
Total Thickness :
0.153±0.005mm
Certification :
ROHS
Place of Origin :
ShenZhen China
Contact Supplier
TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

Shenzhen KHJ Technology Co., Ltd

Site Member
6 Years
shenzhen
Since 1999
Business Type :
Manufacturer, Trading Company, Seller
Main Products :
Semiconductor Packaing Tape, smt spilice tool, SMT Splice Tape & tool
Total Annual :
1800000-20000000
Employee Number :
200~300
Certification Level :
Site Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Thermal Release Tape
MachineU China Products Machinery Electronics Production Machinery
Contact Supplier
Submit Requirement