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DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ
DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ
Specifications
Model Number :
DTS641A
Brand Name :
KHJ
Certification :
ROHS、ISO9001
Place of Origin :
China
Description
Product Description
DTS641A is a double-sided tape with good initial tack. Both sides are covered with foam rubber layers. Under the condition of 110-140 ℃, the viscosity of the foam rubber surface gradually disappears, and it can automatically separate from the adhered objec.
Product structure
DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ
Product features
Excellent weather resistance, no re-adhesion Strong instantaneous viscosity, components are easy to remove after thermal viscosity reduction without residual adhesive Comply with ROHS requirements
Product application
This product is suitable for temporary fixing of various types of components, ceramics, glass, metal plates, etc., and special cutting protection for various electronic industries.
Performance parameters

Test items Measurement standards Test Methods
Product thickness (except release film) (μm) 200±10 micrometer
Substrate thickness (μm) 100±3 micrometer
Foam rubber layer A thickness (μm) 50±4 micrometer

180°Peel force

(gf/25mm)

 Before thermal debonding 700±150 GBT 2792-2014
After heating and debonding <5 GBT 2792-2014
Foam rubber layer B thickness (μm) 50±4 micrometer

180°Peel force

(gf/25mm)

 Before thermal debonding 700±150 GBT 2792-2014
After heating and debonding <5 GBT 2792-2014

◎ Recommended debonding process: 120-135℃*3-10min (based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)
Storage method
Storage conditions: 10-30 ℃, relative humidity
40-60% Storage period: 6 months
Things to note
The product should be kept away from heat and fire sources;
The surface of the object to be attached should be clean, dry, and free of oil or other contamination;
The product cannot be used outdoors to avoid residual adhesive remaining on the o
bject when the tape is removed due to the influence of outdoor weather.
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DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

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Product Detail
Model Number :
DTS641A
Brand Name :
KHJ
Certification :
ROHS、ISO9001
Place of Origin :
China
Contact Supplier
DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

Shenzhen KHJ Technology Co., Ltd

Site Member
6 Years
shenzhen
Since 1999
Business Type :
Manufacturer, Trading Company, Seller
Main Products :
Semiconductor Packaing Tape, smt spilice tool, SMT Splice Tape & tool
Total Annual :
1800000-20000000
Employee Number :
200~300
Certification Level :
Site Member
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