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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ
TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ
Specifications
Model Number :
TS652D
Brand Name :
KHJ
Certification :
RoHS
Place of Origin :
ShenZhen
Description

Description

TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and easily peel off by heating under a certain high temperature (110-140°C) .

TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

Features
* High initial adhesion and certain heat resistance ,no sticking back
* After heating ,easy to peel off and no any residual.
* Excellent tensile strength & Elongation
* RoHS Compliant
Application
* For electronic component ,glasses ,wafer ,ceramics manufacturing processes.
* For various temporary fixing
Item Typical Value Test Method
Imperial Metric
Backing 4mils 0.1mm /
Total Thickness 6mils 0.15mm /
180°peel force(N/25mm) Before heating 1.98lbs/in 9N/25mm GBT 2792-2014
After heating 0 0

Recommended heating release Temperature: 110-140℃*5-15min (depending on the thermal conductivity and heating uniformity of the object )

Storage

  • Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.
  • Shelf life: 6 months from the date of manufacture when stored in initial packing.

Precaution Reminder

  • Surface should be clean, dry, free of dust, oil or other contaminants.
  • Proper pressure required by roller, hand or press when applying.
  • Avoid repeat sticking to prevent adhesion decrease.

Notes

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

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TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

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Product Detail
Model Number :
TS652D
Brand Name :
KHJ
Certification :
RoHS
Place of Origin :
ShenZhen
Contact Supplier
TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

Shenzhen KHJ Technology Co., Ltd

Site Member
6 Years
shenzhen
Since 1999
Business Type :
Manufacturer, Trading Company, Seller
Main Products :
Semiconductor Packaing Tape, smt spilice tool, SMT Splice Tape & tool
Total Annual :
1800000-20000000
Employee Number :
200~300
Certification Level :
Site Member
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