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0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm
0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm
Specifications
Brand Name :
GaNova
Place of Origin :
Suzhou China
MOQ :
1
Delivery Time :
8-10week days
X-axis Cutting speed :
0.1 ～ 600mm/s
Product Name :
DAD3350 Automatic Dicing Saw
Max. workpiece size :
Φ8 inch (250mm × 250mm, Φ300mm user-specified specification)
Application :
1.8kW, 2.2kW
Machine dimensions(W×D×H)mm :
900 × 1,050 × 1,800
X-axis Cutting range :
260mm
Description

DAD3350 Wafer Dicing Machine 0.1 ～ 600mm/s X-Axis Cutting Range 260mm

Improved throughput

The DAD3350 achieves improvement in throughput by increasing the speed of each axis.

Ease of use

Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operation is achieved with a visual display showing processing conditions and various statuses with icon buttons. In addition, operation commonalities were considered in order to achieve easy replacement from the 300/500 series (existing models).

Process quality

By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

Specifications

Specification

Unit

1.8 kW

2.2 kW

Max. workpiece size

-

Φ8 inch (250 mm × 250 mm, Φ300 mm user-specified specification)

X-axis

Cutting range

mm

260

Cutting speed

mm/s

0.1 ～ 600

Y-axis

Cutting range

mm

260

Index step

mm

0.0001

Index positioning accuracy

mm

0.002/260
(Single error) 0.002/5

Z-axis

Max. stroke

mm

32.2

31.4

Moving resolution

mm

0.00005

Repeatability accuracy

mm

0.001

θ-axis

Max. rotating angle

deg

380

Spindle

Rated torque

N・m

0.29

0.70

Revolution speed range

min‐1

6,000 ～ 60,000

3,000 ～ 30,000

Machine dimensions(W×D×H)

mm

900 × 1,050 × 1,800

Machine weight

kg

Approx. 1,200

* Product appearance, features, specifications, and other details may change due to technical modifications.
* Please read the standard specification sheet thoroughly before use.

Product tags

cnc machining 5 axis

,

5 axis cnc machining

,

cutter plotter specifications
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0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm

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Product Detail
Brand Name :
GaNova
Place of Origin :
Suzhou China
MOQ :
1
Delivery Time :
8-10week days
X-axis Cutting speed :
0.1 ～ 600mm/s
Product Name :
DAD3350 Automatic Dicing Saw
Contact Supplier
0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm

Shanghai GaNova Electronic Information Co., Ltd.

Active Member
4 Years
shanghai, shanghai
Since 2020
Business Type :
Manufacturer
Main Products :
GaN Epitaxial Wafer, SiC Epitaxial Wafer, GaAs Epi Wafer
Employee Number :
>100
Certification Level :
Active Member
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