This document outlines the specifications for the MICRO XNJ ZB2 product from SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details the material composition, mechanical, environmental, and electrical performance characteristics, along with testing methods and standards. This product is designed for applications requiring reliable connectivity under various environmental conditions.
| Category | Specification | Test Method/Reference Standard |
| Mechanical Performance | Insertion Force: 3.0kgf MAX | EIA 364-13A |
| Extraction Force: 0.7~1.8 kgf | EIA 364-13A | |
| Terminal Single PIN Retention Force: 0.5 kgf MIN | EIA 364-09A | |
| Electrical Performance | Contact Resistance: 50m MAX | EIA 364-23A |
| Insulation Resistance: 100M MIN (at 100V DC) | EIA 364-21A | |
| Withstand Voltage: 300V AC for 1 minute, 0.5mA | EIA 364-20A | |
| Environmental Performance | Solderability: 95% or more tinning area | MIL STD-202F (Immersion in 2355 solder for 50.5 sec) |
| High Temperature Resistance: No obvious damage, Contact Resistance 100m, Insulation Resistance 100M | MIL STD-1344A (96 hours at 85, then 3 hours at room temp) | |
| Low Temperature Resistance: No obvious damage, Contact Resistance 100m, Insulation Resistance 100M | MIL STD-1344A (-40 for 96 hours, then 3 hours at room temp) | |
| Humidity Resistance: No obvious damage, Contact Resistance 100m, Insulation Resistance 100M | EIA 364-31A (402, 9095%RH for 120 hours) | |
| Corrosion Resistance: No obvious corrosion, Contact Resistance 50m MAX | EIA 364-26A (5% salt spray, 352 for 12 hours, then 1 hour at room temp) | |
| Solderability (Reflow): No obvious discoloration/bubbling, smooth solder joints | Recommended reflow curve | |
| Durability | Insertion/Extraction Cycles: 3000 cycles | EIA 364-28A (25mm/min) |
| Vibration Test | Frequency 10Hz-55Hz-10Hz cycle, 1.5mm amplitude, 2 hours per X/Y/Z axis | Reference standard not fully specified |