This document outlines the specifications for the HX MICRO QT JB, a MicroUSB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details material composition, mechanical, electrical, and environmental performance requirements.
| Category | Item | Specification | Test Method / Reference |
|---|---|---|---|
| Mechanical Performance | Insertion Force | 3.57Kgf MAX | EIA 364-13A |
| Withdrawal Force | 0.5kgf MIN | EIA 364-13A | |
| Terminal Single PIN Retention Force | 1.0Kgf MIN | EIA 364-20A | |
| Durability | 5000 cycles | EIA 364-09A | |
| Electrical Performance | Contact Resistance | 30m MAX | EIA 364-23A |
| Insulation Resistance | 100M MIN (100V DC) | EIA 364-21A | |
| Withstand Voltage | 250V AC 1 minute 0.5mA | EIA 364-20A | |
| Environmental Performance | Solderability | Tin coverage 95% | MIL STD-202F |
| High Temperature Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | MIL STD-1344A (85, 96 hours) | |
| Low Temperature Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | MIL STD-1344A (-40, 96 hours) | |
| Humidity Resistance | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN | EIA 364-31A (402, 9095RH, 120 hours) | |
| Corrosion Resistance | Appearance: No obvious corrosion; Contact Resistance: 50m MAX | EIA 364-26A (5% salt spray, 352, 12 hours) | |
| Heat Resistance (Soldering) | Appearance: No obvious discoloration/bubbling; Solder joint: Smooth tinning | Immersion in 2355 tin bath for 50.5 seconds | |
| Vibration Test | Amplitude: 1.5mm; Frequency: 10Hz to 55Hz and back to 10Hz per minute cycle; Duration: 2 hours each in X/Y/Z directions | EIA 364-28A | |
| Working Conditions | Working Voltage/Current | 30V / 1.8Ampere | - |
| Working Conditions | Operating Temperature | -30+80 | - |