Precision CNC Machined Copper Heat Sink – Syris Manufacturing

Product Overview

This precision CNC-machined component, produced by Syris, is an elongated copper heat sink featuring a dense array of longitudinal cooling fins along its length, interrupted by four flanged mounting sections with precision-bored holes. The bright, natural copper finish reflects the material's superior thermal conductivity and highlights the fine detail achievable in fin machining.

Key Features

• High-Density Fin Array — A tightly spaced series of precision-milled longitudinal fins runs the full length of the part, maximizing surface area for efficient heat dissipation.
• Solid Copper Construction — Copper offers significantly higher thermal conductivity than aluminum, making it ideal for high-heat-flux applications where compact, efficient cooling is critical.
• Multiple Flanged Mounting Points — Four wing-like flange sections are integrated along the fin body, each with precision-bored through-holes for secure attachment to a heat source or enclosure.
• Slender, Elongated Profile — The narrow, extended form factor allows the heat sink to be fitted into confined or linear spaces alongside other components.
• Deep Fin Machining — Fins are cut to a consistent depth and pitch, demonstrating precise control of tool path and material removal in a challenging, high-aspect-ratio geometry.
• Bright Natural Copper Finish — An untreated, polished copper surface provides maximum thermal performance and a distinctive bright appearance.

Applications

Ideal for power electronics cooling, LED or laser diode heat management, battery module thermal regulation, and other high-performance thermal applications requiring maximum heat transfer in a compact, mountable form factor.

Manufacturing Capability

This part demonstrates Syris's capability in precision fin machining on high-conductivity, softer metals such as copper — combining fine-pitch fin milling with accurate flange drilling to produce components optimized for demanding thermal management applications.