Chongqing Zhongshun Microelectronics Co., Ltd
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1 Years
chongqing, chongqing
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Supplier Homepage > Products > SIP Packaging

PRODUCT CATEGORIES

Camera Sensor Module

 (19)

ST Sensor

 (31)

MIPI Camera Module

 (32)

DVP Camera Module

 (7)

AHD Camera Module

 (1)

USB Camera Module

 (21)

Global Shutter Camera Module

 (7)

Raspberry Pi Camera Module

 (1)

OEM Camera Module

 (1)

Optical Lens

 (1)

Image Module

 (1)

Image Sensor Packaging

 (1)

MEMS Sensor

 (1)

SMT Testing

 (6)

SIP Packaging

 (6)
Product Categories

SIP Packaging

6
Choose from our sip packaging products, find out more, and feel free to inquiry us
The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable
Hot selling!
SIP Packaging

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable
Model：2D planar SiP
Size：Supports rapid sample customization
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Stacked die SiP supports the integration of various types of dies such as memory and power dies
Hot selling!
SIP Packaging

Stacked die SiP supports the integration of various types of dies such as memory and power dies
Model：Stacked-die SiP
Intermediate layer：No intermediate layer
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3D SiP can customize differentiated 3D stacking architectures according to customer requirements
Hot selling!
SIP Packaging

3D SiP can customize differentiated 3D stacking architectures according to customer requirements
Model：3D SiP
Size：Supports rapid sample customization
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Customization System In Package For IoT / Automotive Electronics
SIP Packaging

Customization System In Package For IoT / Automotive Electronics
Size：Supports rapid sample customization
Brand Name：Chippack
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SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP
SIP Packaging

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP
Model：SiP
Substrate Type：Organic ABF substrates, HTCC ceramics, LTCC ceramics, silicon interposers, glass interposers
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2.5D SiP can integrate various bare dies to meet differentiated functional requirements
SIP Packaging

2.5D SiP can integrate various bare dies to meet differentiated functional requirements
Model：2.5D SiP
Intermediate layer：Silicon / Glass Interposer
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