CMP Damped Fabric Polishing Pad — For Ultimate Surface Perfection
POLISHER Conditioned Fabric Pad (Black) is a key consumable in Chemical Mechanical Planarization (CMP) for precision materials such as semiconductor chips and optical glass, delivering the final step toward flawless, defect-free surfaces.
Key Features:
Role in CMP Process:
Serves as the final conditioning stage in CMP processing, following coarse polyurethane and mid-stage non-woven pads to deliver a flawless, damage-free finish.
Applications:
Ideal for semiconductor chip and optical glass finishing — the final step for applications requiring ultimate surface perfection and precision planarization.
Certifications: Manufactured under ISO9001 Quality Management System certification.