Polyurethane Polishing Pad - Red Pad
The Workhorse for Coarse Polishing — The Powerhouse of Rough Grinding
POLISHER Polyurethane Polishing Pad (Red) is engineered as a powerhouse for rough grinding, delivering efficient coarse polishing performance in Chemical Mechanical Planarization (CMP) processes on sapphire and silicon wafers.
Key Features:
- Polyurethane Construction – Durable polymer material provides consistent, dependable performance under sustained coarse polishing conditions
- Powerful Rough Grinding – Engineered specifically for the demands of initial-stage coarse material removal
- Efficient Coarse Polishing – Your engine for fast, effective material removal at the start of the CMP process chain
- Compatible with Multiple Slurries – Works with alumina/cerium oxide and liquid applications including silica, silicon carbide, and diamond
- Customizable Specifications – Available in customizable configurations to meet specific process requirements
Applications:
Designed as the first stage in the CMP "coarse-to-polish" chain — ideal for the coarse polishing of sapphire and silicon wafers before intermediate and final-stage finishing.
Certifications: Manufactured under the ISO 9001 Quality Management System.