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Sputtering Target Bonding Adhesive Process Friendly Stress Buffering
Sputtering Target Bonding Adhesive Process Friendly Stress Buffering
Specifications
Brand Name :
APG
Place of Origin :
china
Certification :
ISO9001、ISO14001、ISO45001、IAFT16949
Packaging Details :
Vacuum-sealed packaging, case-packed for storage and transport
Delivery Time :
4-5 weeks
Payment Terms :
T/T
Supply Ability :
Stable supply
Name :
Target Bonding Adhesive
Core Functions :
Firmly bonding the target to the backing plate, provding mechanical support for brittle targets (such as ceramic targets) to prevent cracking or deformation.
Key Features :
Process Friendly, Stress Buffering,Overall Performance Stability
Application Field :
Target Bonding
Description

Target Bonding Adhesive is a specialized adhesive used to securely bond sputtering targets to the backing plate. It plays a key role in processes such as physical vapor deposition (PVD).

Core Advantages

● Process Friendly

It typically cures at temperatures from medium to low, avoiding potential damage to target material properties from high temperatures, and is relatively easy to operate.

● Stress Buffering

With certain flexibility, it effectively alleviates stress generated between the target and the backing plate due to differences in thermal expansion coefficients.

● Overall Performance Stability

It has good chemical and mechanical stability, strong adhesion to various substrates (such as aluminum, copper, stainless steel, glass), and is environmentally friendly and non-toxic.

Application Fields

● Ceramic and Brittle Target Bonding

Especially suitable for bonding ceramic targets such as ITO (Indium Tin Oxide) and SiO₂, which are brittle and require bonding for support and heat dissipation.

● Thermally Sensitive or Special Targets

Suitable for targets that cannot withstand high-temperature bonding (such as certain oxide targets), organic targets, or temporary bonding applications.

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Sputtering Target Bonding Adhesive Process Friendly Stress Buffering

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Product Detail
Brand Name :
APG
Place of Origin :
china
Certification :
ISO9001、ISO14001、ISO45001、IAFT16949
Packaging Details :
Vacuum-sealed packaging, case-packed for storage and transport
Delivery Time :
4-5 weeks
Payment Terms :
T/T
Contact Supplier
Sputtering Target Bonding Adhesive Process Friendly Stress Buffering

Shenzhen APG Material Company Limited

Verified Supplier
1 Years
shenzhen
Main Products :
Sputtering Target Material, Ceramic Targets, Metal Sputtering Target
Certification Level :
Verified Supplier
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