Product Description
The Polyimide Film Adhesive Tape features a PI film base for excellent heat resistance, strength, and dielectric performance, combined with a high-temperature silicone adhesive for reliable bonding. As a Class H insulation material, it is ideal for demanding applications in motors, electrical equipment, and electronics.
Technical Parameters
| Parameters | Value |
| Tensile strength | ≥35N/10mm |
| Electrical strength | ≥70MV/m |
| Elongation | ≥30% |
| Working Temp. | 200℃ |
| Thickness | 0.03~0.10mm |
Advantages
- Exceptional heat and electrical resistance: Class H (180°C) rating with high dielectric strength for reliable insulation under extreme conditions.
- Secure yet clean adhesion: Strong bond without residue, protecting components during application and removal.
- Enhanced durability: Resistant to punctures, moisture, solvents, and corona discharge for long-lasting performance in demanding environments.
- Optimized for automation: Uniform, bubble-free rolls with precision-cut edges enable smooth, reliable high-speed processing.
Applications
- Electronics: PCB gold finger masking, SMT insulation, wave soldering protection.
- Motor/Transformer: Class H coil wrapping and fixation for high-temperature integrity.
- Lithium Batteries: Secure tab fixation and internal insulation, heat and electrolyte resistant.
- Flexible Circuits: FPC reinforcement and moisture insulation in high-temperature assembly.
