PI film heat-resistant protection film
Base film: PI film
Adhesive: silcone adhesive
Appearance: Amber transparent, surface smooth, no crepe,bubble,foreign objects,no tearing and transfer of glue layer when unwinding
Technical Specifications
| Type # | 2321 | 2321L |
| Total thickness mm | 0.06 |
| Break down voltage KV | ≥5% |
| Tensile strength N/10mm | ≥40 |
| Adhetion strength N/10mm | ≥2.4 |
| Working temperature °C | -73~280 |
| Chemical resistance 20% HCL NaOH/10Hrs | Bonding well,do delamination,no glue layer transfer |
| Releasing film mm | no | 0.075mm |
Character
- Key Properties: High mechanical strength, excellent electrical insulation, dimensional stability, and resistance to high temperatures, solvents, and water.
- Temperature Rating: Long-term operation at 220°C; short-term exposure up to 280°C.
Application
- Bonding Protection: Ideal for SMT wave/reflow soldering temperature shielding, and for protecting electronic switches, PCB gold fingers, SMD transformers, relays, and other heat- and moisture-sensitive components.
- Insulation Wrapping: Used for high-temperature coil insulation in H-class motors and transformers, securing coil ends, and providing reliable insulation in demanding thermal environments.
