Product introduction:
- Molybdenum-copper alloy heat sink used in electronic sealing , similar to tungsten-copper alloy, also has compositional adjustability to have adjustable thermal conductivity and thermal expansion coefficient.
- Molybdenum-copper alloys have a lower density than tungsten-copper alloys but a higher coefficient of thermal expansion.
Type | Mo Wt% | Cu Wt% | g/cm3 | W/(M.K) | (10-6/K) |
Mo85Cu15 | 85± 1 | Balance | 10 | 160 - 180 | 6.8 |
Mo80Cu20 | 801 | Balance | 9.9 | 170 - 190 | 7.7 |
Mo70Cu30 | 701 | Balance | 9.8 | 180 - 200 | 9.1 |
Mo60Cu40 | 601 | Balance | 9.66 | 210 - 250 | 10.3 |
Mo50Cu50 | 50 ±0.2 | Balance | 9.54 | 230 - 270 | 11.5 |
Advantages