TIC800H-SP Superior reliable thermal performance Thermal Phase Change material For Power Conversion Equipment

TIC^®800H-SP Series is athermal phase change material in the formof a paste,designed tominimize thermal resistance at the interface and maintain extremely stable performance through reliability testing required for long-life applications. Based on a robust polymer phase change memory structure, this material exhibits excellent weting properties within a typical operating temperature range, resulting in extremely low surface contact resistance. This proprietary technology provides materials with excellent reliability and maintains low thermal impedance, making phase change memory an ideal choice for high-performance integrated circuit devices.

Features

> High performance filler and polymer technology
> Highly conductive filler loading to optimize performance
> Superior handling and reworkability
> Superior reliable thermal performance

Applications

> Power conversion equipment

> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation

> Automotive & Power
> IT/Enterprise
> Telecomm
> Consumer Electronics
> High-Brightness LED

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .