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6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board
6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board
6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board
6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board
Specifications
Material :
FR-4 High-Tg 170
Solder Mask Color :
Matte Black
Supply Ability :
1 Million Square Feet per Month
Impedance Control :
+/-10%
Certification :
UL, ISO9001
Delivery Time :
8-15 Days
Price :
Negotiable
Min Laser Drill (Microvia) :
0.1 mm
Payment Terms :
T/T, Western Union, PayPal
Layer Count :
6-Layer (1+4+1 HDI)
Surface Finish :
ENIG
Brand Name :
XSW PCB
Model Number :
XSW-HDI6
Place of Origin :
China
Outer / Inner Copper :
1 oz / 0.5 oz
Packaging Details :
Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton
Board Thickness :
1.0 mm (Customizable)
Min Line Width / Spacing :
0.05 mm / 0.05 mm
MOQ :
1 Piece
Description

6 Layer HDI Multilayer PCB Fabrication with 0.05mm Fine Line for Drone Flight Controller

This 6-layer HDI multilayer PCB is engineered for drone flight controller and inertial navigation modules where dense routing, high-speed signal integrity and low board weight are mission critical. The board is built on high-Tg FR-4 with laser-drilled microvias, LDI fine-line imaging and controlled impedance, delivering a compact, high-reliability interconnect platform for UAV electronics.

Key Specifications

Layer Count6-Layer (1+4+1 HDI stack-up)
MaterialFR-4 High-Tg 170 (Optional: Rogers / high-frequency)
Board Thickness1.0 mm (Customizable 0.6-2.0 mm)
Outer / Inner Copper1 oz / 0.5 oz
Min Line Width / Spacing0.05 mm / 0.05 mm
Min Laser Drill (Microvia)0.1 mm
Impedance Control±10% (single-ended & differential)
Solder MaskMatte Black
Surface FinishENIG (Immersion Gold)

Production Technical Difficulties We Solve

1. Microvia Laser Drilling Control

Blind and buried vias are laser-drilled down to 0.1 mm with strict aspect-ratio control, preventing barrel cracking and ensuring reliable copper plating in the microvia walls.

2. Fine Line / Space Imaging (0.05 mm)

Laser Direct Imaging (LDI) is applied to resolve 0.05 mm traces, holding registration precision to avoid open circuits and copper shorts on densely populated routing areas.

3. Layer-to-Layer Registration

CCD target punching and x-ray alignment keep 6-layer registration within ±0.025 mm, eliminating layer offset that would otherwise ruin impedance and via connectivity.

4. Controlled Impedance for High-Speed Signals

Stack-up and trace geometry are simulated and verified to hold ±10% impedance, protecting signal integrity between the flight controller MCU, IMU and communication links.

5. Sequential Lamination Reliability

Multiple lamination cycles are executed without resin starvation or delamination, preserving dielectric thickness consistency across every HDI layer.

Why It Performs in Flight

ApplicationDrone flight controller, IMU, gimbal and navigation boards
Assembly ServiceSMT / BGA / QFN / fine-pitch BGA assembly available
Prototype Lead Time3-5 days for prototype, 8-15 days for mass production
TestingFlying probe, impedance coupon, AOI and 100% electrical test
Send your Gerber files and stack-up requirements, and our engineering team will return a DFM review and quotation within 24 hours.
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6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board

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Product Detail
Material :
FR-4 High-Tg 170
Solder Mask Color :
Matte Black
Supply Ability :
1 Million Square Feet per Month
Impedance Control :
+/-10%
Certification :
UL, ISO9001
Delivery Time :
8-15 Days
Contact Supplier
6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board
6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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