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ENIG Finish Interface 2 Layer PCB Board For Optical Communication Equipment
ENIG Finish Interface 2 Layer PCB Board For Optical Communication Equipment
Specifications
Material :
FR4
Minimum Hole Size :
0.25mm
Certification :
UL ,IOS9000
Place of Origin :
China
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Brand Name :
XSW PCB
Model Number :
XSWPCB
MOQ :
1
Price :
Negotiable
Delivery Time :
8-15DAYS
Board Thickness :
1.2mm
Copper Thickness :
1/1 oz
Minimum Line Width :
0.2mm
Layer Count :
2 Layers
Description
2-layer ENIG Optical Communication Equipment Interface Board
This 2-layer ENIG optical communication equipment interface board features advanced manufacturing processes and precise specifications for reliable performance in optical communication applications.
Key Specifications
Layer Count 2 Layers
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1 oz
Minimum Hole Size 0.25mm
Minimum Line Width 0.2mm
Minimum Line Spacing 0.2mm
Solder Mask Color Green
Surface Finish ENIG
Application Field Optical Communication Equipment Interface
Critical Production Processes
  • Pattern transfer on both outer layers uses vacuum lamination technology to ensure tight adhesion between dry film and copper surface, avoiding bubble generation
  • After etching, AOI (Automated Optical Inspection) is required to screen out defects such as undercuts, pinholes, and shorts
  • Drilling process uses coated drill bits and backup board structures to reduce hole wall burrs, followed by desmearing treatment
  • Plasma treatment is performed before electroless copper deposition, followed by backlight test after copper deposition
  • Solder mask uses CCD screen printer with repeat positioning accuracy of ±15μm to ensure solder mask opening alignment
  • Before ENIG, pretreatment including degreasing, micro-etching, and activation is required
  • Nickel bath temperature controlled at 82-88°C, nickel layer thickness of 3-6μm, phosphorus content of 10-12%, and gold layer thickness of 0.05-0.1μm
  • During ENIG process, nickel bath potential must be monitored online (-1.0V to -1.2V)
  • After ENIG, tape pull testing, nickel layer cross-section analysis, and solderability testing are required
  • Final TDR impedance testing (deviation within ±5%) and 100% electrical testing are completed
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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ENIG Finish Interface 2 Layer PCB Board For Optical Communication Equipment

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Product Detail
Material :
FR4
Minimum Hole Size :
0.25mm
Certification :
UL ,IOS9000
Place of Origin :
China
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Contact Supplier
ENIG Finish Interface 2 Layer PCB Board For Optical Communication Equipment

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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