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Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products
Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products
Specifications
Model Number :
XSWPCB
Material :
Fr4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.5 mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
6-Layer
Description

Multilayer High Frequency Circuit Board PCB Fabrication 1OZ for Electronic Products

Multilayer High Frequency Circuit Board PCB Fabrication 1OZ for Electronic Products is a high-performance PCB solution designed for high-speed signal transmission, RF communication, industrial electronics, networking equipment, automotive systems, and advanced consumer electronics. Featuring a multilayer PCB structure with 1oz copper thickness, this circuit board provides excellent electrical performance, stable impedance control, and reliable signal integrity for demanding electronic applications.

Key Specifications
Layer Count 6-Layer
Material Fr4
Board Thickness 1.5 mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

1oz Copper Thickness

  • Standard 1oz copper for reliable conductivity.
  • Excellent current-carrying capability.
  • Suitable for most commercial and industrial applications.

High-Frequency Performance

  • Optimized for RF and high-speed signal transmission.
  • Low signal attenuation and transmission loss.
  • Ideal for communication and networking products.

Controlled Impedance Capability

  • Precision impedance control for signal-critical circuits.
  • Improves signal integrity and transmission stability.
  • Supports high-speed digital and RF applications.

Superior Signal Integrity

  • Reduced EMI and crosstalk.
  • Stable electrical performance across multiple layers.
  • Reliable operation in complex electronic systems.

Advanced PCB Fabrication Technology

  • High-precision drilling and multilayer lamination.
  • Accurate layer-to-layer registration.
  • Consistent manufacturing quality.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products

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Product Detail
Model Number :
XSWPCB
Material :
Fr4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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