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6 Layer Vehicle Communication Circuit Board With Immersion Gold
6 Layer Vehicle Communication Circuit Board With Immersion Gold
Specifications
Price :
Negotiable
Material :
FR-4 TG150
Minimum Hole Size :
0.2 mm
Minimum Line Spacing :
0.1 mm
Supply Ability :
1 Million Square feet/per month
Payment Terms :
Western Union
Brand Name :
XSW PCB
Board Thickness :
1.2mm
MOQ :
1
Copper Thickness :
1/1/1/1/1/1 Oz
Certification :
UL ,IOS9000
Model Number :
XSWPCB
Delivery Time :
8-15DAYS
Minimum Line Width :
0.12mm
Place of Origin :
China
Layer Count :
6
Description

6-layer immersion gold vehicle communication

Key Specifications
Layer Count 6-Layer
Material FR-4 TG150
Board Thickness 1.2mm
Copper Thickness 1/1/1/1/1/1 Oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.12mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Blue
Surface Finish ENIG
Application Field Industrial control system

Product Description:

1. Material Selection

Substrate: High Tg material (glass transition temperature ≥150°C) is selected to meet heat resistance and CAF (Conductive Anodic Filament) resistance requirements.

Copper Foil: Low-roughness copper foil is used in high-frequency signal areas to reduce signal transmission loss.

Surface Finish: Immersion gold (ENIG) process is preferred, with precise control of gold layer thickness (0.15-0.2μm for RF areas) to ensure solderability, oxidation resistance, and low contact resistance.

2. Precision Circuit Fabrication

Due to the high integration level of vehicle-mounted terminals, LDI (Laser Direct Imaging) technology is adopted to achieve high-precision circuit pattern transfer, with line width/line spacing controlled below 50μm. Line width tolerance is strictly controlled (±5μm or ±0.02mm) to avoid signal integrity issues caused by over-etching or incomplete etching.

3. Multilayer Board Lamination

Supports 4-16 layers (including HDI/any-layer) high-density interconnect design. High-precision alignment systems and vacuum lamination processes are employed to strictly control layer-to-layer registration (layer misalignment ≤10% of hole diameter), ensuring multilayer board bonding strength and reliability.

4. Impedance Control

RF communication (4G/5G, V2X) and high-speed digital signals (Ethernet) in vehicle-mounted terminals have strict impedance control requirements. Precise control of line width, dielectric thickness, and dielectric constant is required to ensure characteristic impedance tolerances (e.g., 50Ω single-ended, 100Ω differential) within ±5% to ±10%.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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6 Layer Vehicle Communication Circuit Board With Immersion Gold

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Product Detail
Price :
Negotiable
Material :
FR-4 TG150
Minimum Hole Size :
0.2 mm
Minimum Line Spacing :
0.1 mm
Supply Ability :
1 Million Square feet/per month
Payment Terms :
Western Union
Contact Supplier
6 Layer Vehicle Communication Circuit Board With Immersion Gold

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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