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1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board
1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board
Specifications
Brand Name :
Lensen
Certification :
CE
Place of Origin :
China
Layer :
6L
Base Material :
FR4 TG170
Board Thickness :
1.54mm
Final Copper Thickness :
1OZ
Description

High density PCB Multilayer PCB China PCB factory

High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4*5.37
Min Hole Size: 0.15mm
Special Request: Impedance Control

Product tags

pcb copper sheet fr4

,

fr4 in pcb

,

bc 1002new pcb
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1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board

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Product Detail
Brand Name :
Lensen
Certification :
CE
Place of Origin :
China
Layer :
6L
Base Material :
FR4 TG170
Board Thickness :
1.54mm
Contact Supplier
1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board

Shenzhen Qianhai Lensen Technology Co., Ltd

Verified Supplier
7 Years
guangdong, shenzhen
Since 2014
Business Type :
Manufacturer, Distributor/Wholesaler, Seller
Main Products :
Wireless Control Module, Wireless Irrigation Controller, Wireless Modbus RTU
Total Annual :
1000000-10000000
Employee Number :
100~120
Certification Level :
Verified Supplier
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