Key Advantages:
* Enhanced Electrical Stability – Low resistance for consistent signal transmission.
* Efficient Heat Management – Reduces thermal stress in high-power applications.
* Corrosion-Resistant Alloy – Prolongs lifespan in humid or high-temperature conditions.
* Industry-Compliant – Meets MIL-STD-883 and JEDEC standards.
Applications:
* Power semiconductor packaging
* EV battery interconnects
* Aerospace microelectronics
Silver alloy Bonding Wire AG99% | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
YF-99 | 18(0.7mil) | >4 | 3-20 | 500/1000 |
99B | 20(0.8mil) | >5 | 3-20 | 500/1000 |
SW-21 | 23(0.9mil) | >7 | 3-20 | 500/1000 |
99A | 25(1.0mil) | >8 | 3-20 | 500/1000 |
99A | 30(1.2mil) | >11 | 3-20 | 500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application: