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0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
Specifications
Brand Name :
WINNER
Model Number :
TW011
Certification :
ISO9100
Place Of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Coating Thickness :
0.0003mm
Material :
Tungsten
Wire Diameter :
0.02mm/0.03mm/0.04mm/0.05mm/0.06mm/0.07mm/0.1mm/0.2mm
Length :
1000/2000 meter
Melting Point :
3410 °C
Boiling Point :
5660 °C
Density :
19.3 g/cm3
Electrical Resistivity :
4.9 μΩ-cm
Description
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion for Semiconductor Bonding
High purity tungsten base with dense gold layer, excellent anti-corrosion and oxidation resistance, ideal for ultra-fine semiconductor bonding and micro electronic assembly.
Product Specifications
Material Tungsten
Purity Wu≥ 99.99%
Gold-plated thickness 0.3um
Wire diameter 0.02mm/0.03mm/0.04mm/0.05mm/0.06mm/0.07mm/0.1mm/0.2mm
Length 1000/2000 meter (cut from roll)
Gold Plated Tungsten Wire Properties (Theoretical)
Compound Formula W
Molecular Weight 183.84
Appearance Metallic wire
Melting Point 3410 °C
Boiling Point 5660 °C
Density 19.3 g/cm³ (25 °C)
Solubility in H₂O N/A
Electrical Resistivity 4.9 μΩ-cm, (20 °C)
Exact Mass 183.951 g/mol
Monoisotopic Mass 183.951 g/mol
Key Features
  • Shiny golden surface condition - brighter than black or white tungsten wire
  • Exceptional high temperature resistance and high melting point
  • Low coefficient of thermal expansion
  • Superior corrosion resistance compared to ordinary tungsten wire
Applications
  • Electrode in photocopiers, replacing corrosion-resistant tungsten wire and tungsten aluminum wire
  • Ideal corrosion-resistant electron emission material
  • Applications in high-energy physics, meteorology, and other scientific research fields
Product Images
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
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0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding

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Product Detail
Brand Name :
WINNER
Model Number :
TW011
Certification :
ISO9100
Place Of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding
0.003mm Micro Gold Coated Tungsten Wire Anti-Corrosion For Semiconductor Bonding

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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