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Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Specifications
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Application :
Semiconductor Packaging, Microelectronics, Medical Devices
Package :
Spool
Corrosion Resistance :
High
Bond Strength :
High
Length Meters :
500/1000
Product Type :
Bonding Wire
Coating :
Gold
Purity :
99.999%
Bonding Method :
Ultrasonic
Temperature Range :
-40°C to 200°C
Surface Finish :
Bright
Conductivity :
98%
Package Size :
100 meters
Core Diameter :
25μm/27μm
Coating Thickness :
0.2 ~ 0.8μm
Max Temperature :
450℃
Temperature Shock :
-196 ~ 250℃
Description

Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging


Ready in stock with short lead time, this ultra fine wire offers high reliability and stable quality for mass production in semiconductor packaging lines.

Technical Parameters
Items Data
Chemical analysis (wt%) Mo ≥ 99.9%, Au : 99.99%
Core wire diameter 25μm/27μm in stock, customized
Coating thickness 0.2 ~ 0.8μm
Max. using temperature 450℃
Anti-temperature shock bear -196 ~ 250℃ fast cyclical impact
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging

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Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging

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Product Detail
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging
Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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