Ultra Fine Gold Plated Silver Wire is designed for high-performance semiconductor and microelectronic applications. Combining the superior conductivity of silver with a thin gold plating layer, this wire offers excellent bonding performance, oxidation resistance, and long-term reliability.
With diameters ranging from 15 μm to 25 μm, it is widely used as a cost-effective alternative to traditional gold bonding wire in IC packaging, LED assembly, and precision electronics manufacturing.
Our advanced manufacturing process ensures:
Consistent diameter tolerance
Smooth surface finish
Stable bonding behavior
High tensile strength
This makes it an ideal solution for manufacturers seeking both performance and cost optimization.



